Publications

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9th AEC/APC Europe, Tel Aviv, Israel, 2008, Recursive least square approach to improve the high product mix overlay R2R control issue, Gerhard Spitzlsperger, Michaela Speil.
ASMC, Stresa, Italy, 2007, Multivariate Statistical Control of Product Test Data and Yield, Gerhard Spitzlsperger, Georg Leonardelli, Matthias Frick and Dieter Rathei
ISSM, Tokyo, Japan, 2006, Using product test data for manufacturing process control, Gerhard Spitzlsperger, Matthias Frick and Dieter Rathei
Transactions on Semiconductor Manufacturing, Vol. 18(4), November 2005 Fault Detection for a Via Etch Process using Adaptive Multivariate Methods, Gerhard Spitzlsperger, Carsten Schmidt, Günther Ernst, Hans Strasser and Michaela Speil
GMM Workshop November, 2005, Fraunhofer IISB, Erlangen Adaptation of Novel Process Technologies on Legacy Equipment, Using a 0.35 um - 0.25 um gate etcher for critical 0.18 um processes. Problems and process stabilization. Gerhard Spitzlsperger, Carsten Schmidt, Renesas Semiconductor Europe GmbH, Landshut, Germany. Probably you can find the presentation here.
6th AEC/APC Europe, Dublin, Ireland, 2005, Unit process aspects for APC-software implementation, Georg Roeder, Martin Schellenberger, Lothar Pfitzner, Heiner Ryssel and Gerhard Spitzlsperger.
6th AEC/APC Europe, Dublin, Ireland, 2005, Improved Fault Detection for Hotelling T2 Based Methods by Pre-Processing Data with Empirical or Physical Models, Gerhard Spitzlsperger, Carsten Schmidt, Andreas Schaefer, Michaela Speil, Johann Strasser and Guenther Ernst.
GMM - Workshop 2004: Prozess -und messtechnische Entwicklungen bei Abscheide und Ätzverfahren- Erlangen, Germany 2004, Unit process aspects for APC-software, M. Schellenberger1), G. Roeder1), G. Spitzlsperger2) 1) Fraunhofer IISB, Erlangen, Germany 2) Renesas Semiconductor Europe GmbH, Landshut, Germany. Probably you can find the presentation here.
ISSM, Tokyo, Japan 2004, Fault Detection for a Via Etch Process using Adaptive Multivariate Methods, Gerhard Spitzlsperger, Carsten Schmidt, Günther Ernst, Hans Strasser and Michaela Speil This paper was selected to be among the best papers of the conference and you can find an enhanced version in the November 05 issue of the Transactions on Semiconductor Manufacturing.
Invited Talk at 5th AEC/APC Europe, Dresden, Germany, 2004 Fault Detection and Classification (FDC) for a Via-Etching-Process, C.Schmidt, S.Bartl, M.Speil, J.Straßer, G.Ernst and G.Spitzlsperger..
GMM Workshop - Trends in Plasma Etching Technology - Erlangen, Germany 2003, In-Situ Monitoring of a Via Etching Process, Carsten Schmidt, Johann Strasser, Guenther Ernst and Gerhard Spitzlsperger.
AEC/APC Colorado Springs, Colorado 2003, In-Situ Real-Time Monitoring of a Via Etching Process Carsten Schmidt, Johann Strasser and Gerhard Spitzlsperger.

SPIE Edinburgh, Scotland 2001, Recharacterization of a Tungsten etchback process with special emphasis on PFC emission reduction and throughput optimization, Gerhard Spitzlsperger, Andreas Rupp and Heike Lorenz.

ASMC Munich, Germany 2001, Process Flow for combined Three Layer and Self Aligned Contacts, Gerhard Spitzlsperger, Torsten Liedtke, Masato Sadaoka und Masahiro Shioya.

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