The term plasma source denotes the mechanism and/or apparatus that transforms the supplied electromagnetic energy into acceleration of electrons. This kinetic energy sustains the plasma by electron impact ionization. Actually, in discharges relevant to semiconductor manufacturing there are four basic mechanisms/apparatus applied. Three of them will be discussed briefly in the following sections, namely capacitive, inductive and wave heated discharges. Chapman  gives a good introduction to capacitive discharges, the graduate level book of Lieberman and Lichtenberg  as well as Popov  address all three kind of sources mentioned above.
The fourth, the DC discharge is historically important, but actually due to the necessity of driving a constant current through the sheaths not applicable for plasma etching/deposition of insulators. Instead is is used for the sputtering of conductive materials like aluminum, tungsten or titan. As my personal knowledge (and interest?) is not so big for sputtering processes, I'd like to point you for a more thorough understanding to the literature, the books of Chapman  as well as Franz  provide a good introduction and further references.
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