Some years ago when I started to read and learn about plasma
etching the numerous terms used in the literature were rather
confusing for me. Therefore I will try to use a
consistent nomenclature in the following. Within the
first chapter all the important issues (from my limited point
of view) will be touched and defined shortly. It starts with a
short overview of planar technology used in todays
wafer fabs to produce modern ICs. Then a introduction to
glow discharges and plasmas is given before the two fields
are combined the first time
to explain the basics of plasma etching. In the following
typically used plasma sources and etching processes are described
before the chapter finishes with an introduction to
plasma assisted deposition and plasma damage.
