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Some years ago when I started to read and learn about plasma etching the numerous terms used in the literature were rather confusing for me. Therefore I will try to use a consistent nomenclature in the following. Within the first chapter all the important issues (from my limited point of view) will be touched and defined shortly. It starts with a short overview of planar technology used in todays wafer fabs to produce modern ICs. Then a introduction to glow discharges and plasmas is given before the two fields are combined the first time to explain the basics of plasma etching. In the following typically used plasma sources and etching processes are described before the chapter finishes with an introduction to plasma assisted deposition and plasma damage.


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